Bohr: Our motivation is that we know we have great process technology, and partnering with other strategic companies can be a win-win situation. You can easily search the entire site in several ways. Some of the upper layers are coarser pitch, where performance is important. SMD: But less than eight? IEEE, 2011. On the 14nm generation, he said the smallest critical dimension was the width of a Tri-gate fin, which was about 8 nm, while other critical dimensions ranged from 10nm to 42nm (for the distance between the center of a fin pitch to the center of the next fin pitch). As the cost of wafers and fabbing have risen over the years there has been concern that transistor costs would plateau, which would lead to chip designers being able to increase their performance but only by increasing prices, as opposed to the past 40 years of cheaper transistors allowing prices to hold steady while performance has increased. But when you talk about the number of cores and computing engines, it depends on whether you’re dealing with traditional computing tasks where four cores are better than two cores. The microarchitecture itself can get more performance than the previous Haswell generation at the same frequency, due to features such as a larger out-of-order scheduler, improved address prediction, and improvement in vector and floating point calculation. Thus for what it’s worth the basic facts do appear to check out, but we would be the first to point out that there is more to semiconductor manufacturing than just logic area scaling. Yeah, I'd say it's a combination of software optimization with the fact that Intel isn't only going for X more performance, but also X fewer watts, so overall better perf/W. Bohr: When you’re talking about developing a smart phone chip that is ultra low power that also provides improved performance features that the market expects, you have to pull every trick out of the bag. FinFET technology was pioneered by Digh Hisamoto and his team of researchers at Hitachi Central Research Laboratory in 1989. The feature size and leakage improvements are in-line with previous genartion process nodes, which should be a great help for Intel in their quest to crack the high performance mobile market in the coming year. "Intel's 14 nanometer technology uses second-generation tri-gate transistors to deliver industry-leading performance, power, density and cost per transistor," said Mark Bohr, Intel senior fellow, Technology and Manufacturing Group, and director, Process Architecture and Integration. Considering that nearly all of the company’s lineups are based on the 14nm process, this significantly hindered Intel’s supply chain. So it is emphasizing its lead in 14nm manufacturing.). Compare the i7 4960X against it's true first-generation i7 competitor, the hex-core, Core i7 980X. Another way of looking at it, he said, was to multiply gate pitch and metal pitch, and there he said Intel was at 0.53 for logic area scaling, which he said was better than normal. (As an aside, I was also interested that Bohr's slides showed the Core M processor with 1.9 billion transistors in its 82 mm2 die size, as compared with the 1.3 billion the official diagram has; Intel PR acknowledged the error, and said 1.3 billion is the correct figure.). TSMC) cannot. password? Intel Discloses Newest Microarchitecture and 14 Nanometer Manufacturing Process Technical Details; Imagery. We’ve updated our terms. You need great transistor technology, great package technology, great CPU architectures, the ability to turn off parts of the chip when you don’t need them so you’re saving power, the software links with the chip design so the software knows when to throttle power down. Presentation: Advancing Moore’s Law in 2014 (PDF 3MB) Other News. [18], In September 2011, Hynix announced the development of 15 nm NAND cells. In this case the 14nm process should deliver a roughly 1.6x increase in performance per watt, just as past processes have too. Song, Taejoong, et al. ); But by the time we’re down to 5nm we’ll be looking at non-familiar devices and device structures. I can’t elaborate at this point. (Note that if it scales in both dimensions, you would get a new transistor that was about 50% the size of one on the previous generation, which is what Moore's Law technically predicts. To that end, at a time when ramping up new process nodes is more complex and more expensive than ever, Intel’s 14nm process is especially important. For 10nm, which is where I’m spending most of my time these days, I know we have a solution. if (document.cookie.match(/(^|;)\s*is_mobile=1/)) { In fact, the opposite is true. Sample size of only 2 SoC designs (A14 & Kirin 9000), but so far things are just r…, @IanCutress @radarxrx Data is very stubborn and does not like to be moved. Much of this seems to be part of Intel's push into the foundry space, where it makes chips for other companies. Overall, he said, while single-threaded instructions per cycle were up only a bit in this generation, all this adds up to the point that single-threaded performance over the past 7 years is up 50% at the same speed. Hardmask materials and multiple patterning are required. With foundaries venturing into the FinFET devices it is interesting to see Intel's direction. Beyond that, our research group is working on solutions for 7nm and 5nm. Bohr: Yes. That’s really a significant advantage. They later developed a 15 nm FinFET process in 2001. We’re not just after the high-performance desktop. But when you make transistors smaller they don’t become less leaky. You have to be very clear about what problem and what market segment you’re trying to serve. [12] On May 17, 2011, Intel announced a roadmap for 2014 that included 14 nm transistors for their Xeon, Core, and Atom product lines. This process was designed by IBM for their very large chips with effective power supply and clock distribution capable of producing dies as large as 700 mm² and larger with a hierarchical BEOL of 17 levels of copper interconnect for high performance wire-ability. Samsung node has gone through a number of refinements from 14LPE (14 Low-Power Early) to 14LPP (14 Low-Power Performance) and further. This newsletter may contain advertising, deals, or affiliate links. Intel uses TiN pMOS / TiAlN nMOS as work function metals. It also offers better monitoring of the entire solution, including the separate platform controller hub (PCH) or chipset, so that the PCH in turn can throttle power for connected features, allowing links to go into low-power states for things such as SATA drives, PCI Express, and USB. SMD: What does this do for Intel’s platform strategy, particularly as you go after many markets with very specific needs? Of note is the i7-5557U, which has Intel Iris Graphics 6100 and two cores running at 3.1 GHz, using only 28 watts.[30][31]. Part of the reason is that the market has shifted from desktop applications to more mobile products. While Intel is pushing 14nm transistor and interconnect, TSMC and Common Platform members are using the same interconnect technology that they did at 20nm. In this era, the options are either EUV or 193nm immersion with multi-patterning. Meanwhile it will still be a few months before we can test the first 14nm chips, but based on Intel’s data it looks like they have good reason to be optimistic about their process. Yields are important for any number of reasons, and in the case of Intel’s 14nm process the yields tell a story of their own. Bohr: Everything gets different and tougher, but the problems are solvable—at least at that generation. You want to make as few iterations between the different designs as you can or re-use the cores or some of the circuit blocks between the different chips so you’re not completely redesigning it. Sign up for What's New Now to get our top stories delivered to your inbox every morning. In fact at the present Intel’s 22nm process is the company’s highest yielding (lowest defect density) process ever, which goes to show just how big a set of shoes the up and coming 14nm process needs to fill to completely match its predecessor. Indeed, Sunit Rikhi, the general manager of the foundry business, introduced Bohr and later gave his own talk showing all the options Intel offers. In short, this goes back to the improved interconnect density that was discussed earlier in this article. If you click an affiliate link and buy a product or service, we may be paid a fee by that merchant.

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